The 11th World Radar Expo, held in Hefei, Anhui, concluded successfully yesterday. This civil-military integrated event showcased China’s rapid advancements in radar technology, delivering a series of groundbreaking innovations. Under the theme "Sharing Innovations to Fuel New Productive Forces," the expo spanned four exhibition zones over 50,000 square meters, displaying cutting-edge radar equipment, digital systems, emerging technologies, and electronic infrastructure solutions.
At Booth A324c, Opto-Intel presented its high-reliability packaging solutions for military applications, drawing significant attention with its high-precision, intelligent, and robust technologies.
Radar, an electronic device that detects targets and measures their position/speed via electromagnetic waves, is widely used in military reconnaissance, weather monitoring, air traffic control, aerospace navigation, disaster warning, and civilian security.
As a core sensing equipment in complex electromagnetic environments, radar’s long-term reliability hinges on packaging technology. How to ensure stable operation for over a decade under extreme vibration and temperature shocks? Opto-Intel addressed this challenge by showcasing high-reliability packaging solutions to strengthen the "first line of defense" for military electronics.
Radar packaging technology is rapidly evolving toward high-density integration, heterogeneous material fusion, and intelligent design. Future advancements will focus on miniaturization for higher frequencies (e.g., millimeter-wave/terahertz) and 4D imaging radars—making components more compact, materials more efficient, antennas stealthier, and systems adaptive to environments.
Key Equipment in Radar Packaging
1. Vacuum Reflow Soldering Oven
High-Frequency Component Soldering
Ensures defect-free connections for radar chips (e.g., power amplifiers, mixers) by eliminating oxidation and voids in solder joints under vacuum. A client reported that void rates in T/R module solder joints dropped from 10% to below 2% using this process.
Array Antenna Integration
Enables micron-level precision soldering with nitrogen protection, preventing signal drift and ensuring beam control accuracy.
High-Power Thermal Management
Reduces thermal resistance via molybdenum-copper substrate soldering, meeting demanding heat dissipation needs.
2. Plasma Cleaning System
Pre-Soldering Surface Activation
Removes oxides and contaminants from chip pads, improving solder wettability and reliability. A client noted reduced failure rates in millimeter-wave radar packaging post-cleaning.
Wire Bonding Enhancement
Boosts adhesion for MEMS sensors and antennas by eliminating organic residues.
Complex Structure Cleaning
Cleans micro-gaps in TSV (Through-Silicon Via) packaging, ensuring stable conductivity and minimal signal loss.
Vacuum reflow soldering ovens and plasma cleaning systems play critical roles in radar packaging—ensuring precision welding and deep cleaning. Their synergy drives breakthroughs in reliability and performance.
As military equipment evolves toward intelligence and miniaturization, high-reliability packaging has become a strategic pillar. At the expo, Opto-Intel engaged with industry partners to explore collaboration opportunities, aiming to advance radar technology with battle-tested, localized solutions and safeguard China’s military electronics ecosystem.
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