Applications
Mainly used for inline vacuum reflow soldering of power semiconductors such as IGBT and SiC, compatible with formic acid and flux processes. Compact 4-chamber dual-layer design features less footprint and high realiability.
Features
Four independent chamber, maintenance with no shutdown
Smart auto-loading with seamless track integration
Excellent solder joint quality with void rate below 2%
Rapid and precise temperature control
Automatic filling of formic acid
Uniform infrared radiation heating (±2%)
Intelligent control system, intuitive user interface
Specifications
Heating Plate | 400mm×465mm |
Clearance over Heating Plate | 90mm |
Function | Inline loading/unloading & four independently controlled chamber |
Process Temperature | Max 450℃ |
Gas Channels | MFC control with solenoid valve |
Heating Accuracy | Better than ±0.5℃ |
Heating Uniformity | Better than ±2% (with 35mm edge exclusion) |
Heating Rate | 2℃/s |
Cooling Rate | 0.85℃/s |
Control System | PLC control system with Windows-based IPC |
Chamber Vacuum | 0.05mbar based on dry pump, measured by Pirani gauge |
Power Supply | AC380V, 50Hz, 123kW (including vacuum pump) |
Enclosure Size | W2850mm×D1850mm×H1900mm |
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