Applications
The system is perfectly used for cleaning and surface activation prior to semiconductor packaging process such as die bonding, wire bonding, underfill, molding, etc., capable to effectively remove the surface contaminants of organics and oxides from the packaging materials, excellently enhancing the bonding strength and adhesion performance, thus significantly improving the process yield. With automatic substrates or lead frames loading and unloading assembly, the system is featured with fast cleaning cycle and high cleaning uniformity, particularly suitable for highly demanding production where very high performance of cleaning results is mandatory.
Features
Enhanced surface treatment
Consistent high-uniformity cleaning
High throughput (450 strips/h for 5 lanes)
Automatic operation with loading/unloading for max 5 lanes
Automatic quick conversion of lane width for product changeover
Unique air cooling design in chamber bottom
Smart operation and detailed display
IPC & PLC based control system with touch screen
Specifications
Plasma Frequency | 13.56MHz |
Plasma Power | Standard 600W, (optional 1000W) |
Electrode Cooling | Air cooling at chamber bottom |
Lanes | Standard 4 lanes (max 5 lanes) |
Lane Width | 30-60mm (5 lanes), 30-80mm (4 lanes), over 80mm (1-3 lanes), automatic quick conversion |
UPH | 450 strips (for 5 lanes) |
Chamber Size (internal) | W280mm✕D440mm✕H55mm |
Mass Flow Controllers | Standard 2, flow rate 100sccm each |
Vacuum Gauge | Pirani or capacitance manometer |
Vacuum Pump | Built-in type, ≥50m3/h |
Control System | Windows based touchscreen IPC + PLC control, supporting manual and automatic operation, process recipe program editing/storage/execution, and automatic process data recording and display. Supports MES |
Enclosure Dimension | W1800mm✕D1080mm✕H1500mm (tower lamp excluded) |
Weight | Approx. 700kg |
Power Supply | AC380V, 3P+N+PE, 50Hz, 4kW |
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