Functions and Applications
Mainly used for the packaging of AOC, RFIC, MMIC, hybrid devices, LiDAR, MEMS and other products, applied in optical communication, RFIC/MMIC, semiconductor lasers, MEMS, LiDAR, military, aerospace, healthcare and other fields.
Features
Fully automatic, multi-functional
Supports automatic handling for various material: wafers, waffle/gel pack, tape feeders, magazines
Compatible with different bonding processes: dispensing, dipping, eutectic, flip-chip
Bond force range: 5g-2000g
High-precision mode: ±3μm@3sigma
Supports automatic exchange of die collets
SECS/GEM complaint
简体中文
