Applications
It can efficiently remove organic contaminants and natural oxide layers, enhance bonding and soldering quality through surface activation, suitable for packaging of IC, IGBT, optoelectronic, MEMS, etc. It also supports applications such as photoresist removal and polymer surface activation, without causing physical bombardment damage to materials.
Features
Non-destructive cleaning
High-density plasma
Highly uniform cleaning results
Ultra-fast cleaning cycle
Superior capability of deoxidation cleaning
Specifications
Plasma Generator | 2.45GHz, Max 2000W (magnetron) / Max 2500W (solid-state generator) |
Internal Chamber Size | W370mm✕D560mm✕H110mm |
Chamber Material | Aerospace-grade aluminum alloy |
Gas Channels | Standard with 2 MFCs, more on request |
Vacuum Gauge | Pirani guage or capacitance manometer |
Vacuum Pump | Dry or oil pump |
Chamber Vacuum | Better than 5Pa |
Control System | IPC+PLC |
Enclosure Dimension | W920mm✕D1300mm✕H1800mm (tower lamp excluded) |
Weight | Approx. 500kg (vacuum pump excluded) |
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