

Applications
It is mainly used for the removal of residual photoresist and organic contamination, and plasma surface modification. It features non-destructive and fast photoresist descum.
Features
Non-destructive descum
Downstream plasma
Precise heating temperature control
Rapid descum rate
Workholder height adjustable
Intuitive user interface
Specifications
Plasma Generator | 2.45GHz, 100-1000W |
Work Holder Size | Φ300mm |
Chamber Material | Aerospace-grade aluminum alloy |
Gas Channels | Standard with 2 MFCs, more on request |
Vacuum Gauge | Pirani gauge |
Vacuum Pump | Dry or oil pump |
Chamber Vacuum | Better than 5Pa |
Temperature Control | 30~150℃, adjustable |
Clearance over Workholder | 150~380mm adjustable (from workholder to Faraday cage) |
| PR Etch Rate | Max 100nm/min (depending on processes) |
Control System | IPC & PLC control |
Enclosure Dimension | W1300mm✕D1300mm✕H1250mm (tower lamp excluded) |
Weight | Approx. 435kg (vacuum pump excluded) |