Applications
The system features excellent plasma cleaning capability and plasma uniformity to effectively remove the surface contaminants, thus greatly enhancing the surface adhesion in semiconductor packaging process such as die bonding, wire bonding, underfill, molding, etc. Equipped with a customizable multi-layer workholder, it can be applied to various applications.
Features
High-uniformity plasma cleaning
Enhanced plasma uniformity with optimized gas distribution
Horizontal or vertical electrodes
Advanced design for easy maintenance
Unique chamber wall shielding
IPC & PLC control
Low operation cost
Specifications
Plasma Frequency | 13.56MHz |
Plasma Power | 1000W |
Chamber Size | W350mm✕D585mm✕H490mm (Approx. 80L) |
Chamber Material | SUS or AL |
Electrodes | Horizontal or vertical design available |
Workholder (Vertical Electrodes) | Capability of 8 magazines (max size W100mm✕D250mm✕H150mm) |
Workholder (Horizontal Electrodes) | Up to 7 layers (clearance 44mm, max 290mm✕460mm loading area each layer) |
Chamber Vacuum | Better than 5Pa |
Vacuum Gauge | Pirani gauge or capacitance manometer |
Vacuum Pump | Installed in the equipment frames,≥50m3/h |
Mass Flow Controllers | Standard 2 (3 as option), flow rate 100sccm each |
Control System | Windows based touchscreen IPC + PLC control, supporting manual and automatic operation, process recipe program editing/storage/execution, and automatic process data recording and display. Supports MES |
Enclosure Dimension | W860mm✕D1060mm✕H1870mm (tower lamp excluded) |
Weight | Approx. 350kg (vacuum pump excluded) |
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