Applications
The system is perfectly used for cleaning and surface activation prior to semiconductor packaging process such as die bonding, wire bonding, underfill, molding, etc., capable to effectively remove the surface contaminants from the packaging materials, excellently enhancing the bonding strength and adhesion performance, thus significantly improving the process yield. The system possesses a large-capacity chamber and advancedly-designed electrodes, combing high-uniformity cleaning and production efficiency.
Features
Max 16 magazines loading capacity
Advanced electrode design & excellent uniformity
Outstanding cleaning result & reliable performance
Slim structure with pump built-in
Superior vacuum performance with booster pump
Intuitive graphical user interface
Specifications
Plasma Frequency | 13.56MHz |
Plasma Power | 1000W |
Electrodes | Horizontal or vertical design available |
Chamber Size | W580mm✕D580mm✕H530mm (Approx. 170L) |
Chamber Capacity | Max. 16 magazines |
Vacuum Pump | Primary pump plus booster pump, ≥300m3/h |
Chamber Vacuum | Better than 5Pa |
Vacuum Gauge | Pirani or capacitance manometer |
Mass Flow Controllers | One as standard (max three optional), flow rate 100sccm |
Control System | Windows based touchscreen IPC + PLC control, supporting manual and automatic operation, process recipe program editing/storage/execution, and automatic process data recording and display. Supports MES |
Enclosure Dimension | W1000mm✕D1000mm✕H1850mm (tower lamp excluded) |
Weight | Approx. 600kg |
Power Supply | 380V, 3P+N+PE, 50Hz, 6kW |
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