Applications
The system is perfectly used for cleaning and surface activation prior to semiconductor packaging process such as die bonding, wire bonding, underfill, molding, etc., capable to effectively remove the surface contaminants from the packaging materials, excellently enhancing the bonding strength and adhesion performance, thus significantly improving the process yield. The system possesses a large-capacity chamber and advancedly-designed electrodes, combing high-uniformity cleaning and production efficiency.
Features
Max loading capacity of 16 magazines
Advanced electrode design & excellent uniformity
Outstanding cleaning result & reliable performance
Slim structure with pump installed inside
Superior vacuum performance with booster pump
Intuitive graphical user interface
Specifications
Plasma Frequency | 13.56MHz |
Plasma Power | 1000W |
Electrodes | Horizontal or vertical design available |
Chamber Size | W580mm✕D570mm✕H530mm (Approx. 170L) |
Chamber Material | SUS or AL |
Electrodes | Horizontal or vertical design available |
Workholder (Vertical Electrodes) | Capability of 16 magazines (max size W100mm✕D250mm✕H150mm) |
Workholder (Horizontal Electrodes) | Up to 7 layers (clearance 50mm, max 450mm✕500mm loading area each layer) |
Chamber Vacuum | Better than 5Pa, downstream pressure control as option |
Vacuum Gauge | Pirani gauge or capacitance manometer |
Vacuum Pump | Primary pump plus booster pump, installed inside the equipment frames, ≥400m3/h |
Mass Flow Controllers | Standard 2 (3 as option), flow rate 100sccm each |
Control System | Windows based touchscreen IPC + PLC control, supporting manual and automatic operation, process recipe program editing/storage/execution, and automatic process data recording and display. Supports MES |
Enclosure Dimension | W1060mm✕D1060mm✕H1850mm (tower lamp excluded) |
Weight | Approx. 600kg |
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