Applications
Mainly used for high-reliability & void-free soldering between high-power chips and substrates such as packaging of semiconductor lasers, RFIC/MMIC and power devices, optimizing soldering quality with vacuum, inert, and reducing atmospheres.
Features
Rapid and precise temperature control (±0.5℃)
Excellent solder joint quality with void rate below 2%
Exceptional temperature uniformity (±1.5%)
Formic acid process for low-temperature solders
Precise process gas flow control
Custom direct-heated tooling fixture
Simple and intuitive GUI
Specifications
Heating Plate | 290mm×350mm×6mm |
Clearance over Heating Plate | 100mm |
Process Temperature | Max 450℃ |
Heating Accuracy | Better than ±0.5℃ |
Heating Uniformity | Better than ±2% (with 20mm edge exclusion) |
Heating Rate | 3℃/s |
Cooling Rate | 0.85℃/s |
Gas Channels | MFC control with solenoid valve |
Chamber Vacuum | 0.05mbar based on dry pump, measured by Pirani gauge |
Control System | PLC control system with Windows-based IPC, supporting MES |
Options | Flux process, overpressure process, top heating, barcode scanner |
Power Supply | AC380V, 50/60Hz, 16kW |
简体中文
