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Home
About Us
Profile
Honor
Environment
Philosophy
Team
Distributor
Products
Die Bonder
Plasma Cleaning System
Vacuum Solder Reflow Oven
Silver Sintering System
Inert Gas Glove Box System
Customized Automation Solutions
Technical Service for Semiconductor Process Equipment
News
Company news
Industry news
Media report
Expo Information
Technical Info
Application
Technical file
Contact us
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Vacuum plasma cleaning
Vacuum Solder Reflow Oven
09
2025-10
Singapore
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10
2025-04
Sinter Bonder ND1800
Wide-range bond force, High flexibility
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09
2025-10
Taiwan (P.R.C.)
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10
2025-04
Multi-Function Die Bonder ND1800-MCM
Designed for high precision and high flexibility
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09
2025-10
Malaysia
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15
2024-04
Automatic Eutectic Die Bonder ND5000
High Throughput (UPH up to 5K)
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30
2026-04
Automatic Dual-Emission Die Bonder ND5000-L
Wide-range bond force, High flexibility
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09
2025-10
Vietnam
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