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Home
About Us
Profile
Honor
Environment
Philosophy
Team
Products
Die Bonder
Plasma Cleaning System
Vacuum Solder Reflow Oven
Silver Sintering System
Inert Gas Glove Box System
Customized Automation Solutions
Technical Service for Semiconductor Process Equipment
News
Company news
Industry news
Media report
Expo Information
Technical Info
Application
Technical file
Contact us
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Vacuum plasma cleaning
Vacuum Solder Reflow Oven
10
2025-04
Sinter Bonder ND1800
Wide-range bond force, High flexibility
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10
2025-04
Multi-Function Die Bonder ND1800MCM
Designed for high precision and high flexibility
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15
2024-04
Automatic Eutectic Die Bonder ND5000
High Throughput (UPH up to 5K)
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15
2024-04
Silver Sintering System NS3000
The key equipment for SiC packaging to achieve reliable pressure sintering process for nanomaterials.
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13
2024-03
Microwave Plasma Cleaning System MWD-12
High-Efficiency Desktop System. Suitable for R&D and Pilot Production
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13
2024-03
Microwave Plasma Cleaning System MWD-80
Full-Function System. Suitable for Batch Production
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25
2024-07
Inline High-Density Microwave Plasma System AMP-20LA
Inline High-Density Microwave Plasma System
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09
2025-01
Automatic Direct Plasma Cleaning System RPD-5
Multi-Lanes Auto Operation. Rapid Cleaning in RIE Mode
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