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  • About Us
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Vacuum plasma cleaning Vacuum Solder Reflow Oven
  • Sinter Bonder ND1800

    Wide-range bond force, High flexibility查看详情
  • Multi-Function Die Bonder ND1800MCM

    Designed for high precision and high flexibility查看详情
  • Automatic Eutectic Die Bonder ND5000

    High Throughput (UPH up to 5K)查看详情
  • Silver Sintering System NS3000

    The key equipment for SiC packaging to achieve reliable pressure sintering process for nanomaterials.查看详情
  • Microwave Plasma Cleaning System MWD-12

    High-Efficiency Desktop System. Suitable for R&D and Pilot Production查看详情
  • Microwave Plasma Cleaning System MWD-80

    Full-Function System. Suitable for Batch Production查看详情
  • Inline High-Density Microwave Plasma System AMP-20LA

    Inline High-Density Microwave Plasma System查看详情
  • Automatic Direct Plasma Cleaning System RPD-5

    Multi-Lanes Auto Operation. Rapid Cleaning in RIE Mode查看详情
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