Applications
It is mainly used for die bonding of chips in TOs of the dual-emission 50G PON.
Features
UPH up to 120
Placement accuracy: ±10µm@3Sigma
Bond force: 20g-200g, accuracy ±3g
Automatic angle calibration for TO headers
Supports wafer and waffle pack loading
Compatible with various product sizes (TO60, TO56, etc.)
Easy-to-use operating system (Windows 10 or above) and MES compatible
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