Overview
Automated Control and Data Acquisition System (ACDAS)
Programmable High-Precision Vacuum Oven
Interface Panel Designed for Chip Packaging Equipment
Applications
Mainly used for providing a controlled inert gas environment for high-reliability hermetic semiconductor packaging. It typically works with parallel seam sealers, capacitor discharge welders, or other packaging equipment. Equipped with the vacuum oven for precise and effective degassing of electronic components, it ensures strict atmospheric control for hermetic packaging processes, enabling efficient, reliable, and stable production.
Features
Ergonomic design for comfortable operation
Efficient and reliable degassing by vacuum baking
Perfectly match hermetic sealing equipment
Automatically monitor all the system status
Real-time data display and historical data querying
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