Applications
Utilizing a microwave source array, it generates high-density plasma to rapidly remove microscopic contaminants from material surfaces. Equipped with an advanced automated control system and high-efficiency automatic loading/unloading assembly, it seamlessly connects with upstream and downstream production line equipment, significantly enhancing processing efficiency.
Features
Non-destructive cleaning
High-density plasma
Highly uniform cleaning effects
Fast cleaning cycle
Superior deoxidation cleaning capability
Automatic control system
Specifications
Plasma Generator | 2.45 GHz, max 2000W |
Internal Chamber Size | W370mm✕D560mm✕H70mm |
Chamber Material | Aerospace-grade aluminum alloy |
Gas Channels | Standard with 2 MFCs, more on request |
Vacuum Gauge | Pirani gauge |
Vacuum Pump | Dry or oil pump |
Chamber Vacuum | Better than 5 Pa |
Operation Flow | Automatic loading & cleaning & unloading |
Control System | IPC+PLC |
Power Supply | 380V, 50/60Hz |