Applications
It is mainly designed for planar dispensing/dipping die bonding of TO devices, also compatible with rotary bonding processes.
Features
UPH up to 300
Placement accuracy: ±10µm@3Sigma
Bond force: 20g-200g, accuracy ±3g
Supports wafer and waffle pack loading
Compatible with various product sizes (TO60, TO56, TO46, TO25, TO18, etc.)
Easy-to-use operating system (Windows 10 or above) and MES compatible
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