Die Bonder Plasma Cleaning System Vacuum Solder Reflow Oven Silver Sintering System Inert Gas Glove Box System Customized Automation Solutions Technical Service for Semiconductor Process Equipment
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Recommended Products

Sinter Bonder ND1800

​Wide-range bond force, High flexibility

Multi-Function Die Bonder ND1800MCM

​Designed for high precision and high flexibility

Automatic Eutectic Die Bonder ND5000

​High Throughput (UPH up to 5K)

Silver Sintering System NS3000

​The key equipment for SiC packaging to achieve reliable pres...

Microwave Plasma Cleaning System MWD-80

​Full-Function System. Suitable for Batch Production

Automatic Direct Plasma Cleaning System RPD-5

​Multi-Lanes Auto Operation. Rapid Cleaning in RIE Mode

High-Throughput Plasma Cleaning System RPB-170

​High-Capacity Chamber. Optimize for Magazine Cleaning

Vacuum Solder Reflow Oven VSR-8

​Classic Proven Design. Flexible Configuration

Inert Gas Glove Box System GBA series

​Inert Gas Glove Box System for Hermetic Semi Packaging

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